[{"name":"设计","count":1233,"id":1},{"name":"业界要闻","count":865,"id":2},{"name":"产业发展","count":518,"id":3},{"name":"企业与产品","count":475,"id":4},{"name":"应用","count":218,"id":5},{"name":"测试","count":206,"id":6},{"name":"封装","count":195,"id":7},{"name":"系统设计","count":134,"id":8},{"name":"汽车电子","count":83,"id":9},{"name":"高端访谈","count":65,"id":10},{"name":"工艺","count":62,"id":11},{"name":"制造","count":58,"id":12},{"name":"知识产权","count":38,"id":13},{"name":"设计技术","count":36,"id":14},{"name":"市场","count":35,"id":15},{"name":"创新专栏","count":31,"id":16},{"name":"封装测试","count":23,"id":17},{"name":"经营管理","count":22,"id":18},{"name":"重大新闻","count":21,"id":19},{"name":"基地园区","count":19,"id":20},{"name":"系统","count":19,"id":21},{"name":"年会特别报道","count":18,"id":22},{"name":"EDA","count":17,"id":23},{"name":"设计开发","count":17,"id":24},{"name":"封装与测试","count":15,"id":25},{"name":"抗击疫情专栏","count":14,"id":26},{"name":"设备","count":12,"id":27},{"name":"企业产品","count":11,"id":28},{"name":"材料","count":10,"id":29},{"name":"基地与园区","count":9,"id":30},{"name":"设备材料","count":8,"id":31},{"name":"中国芯","count":7,"id":32},{"name":"专家论坛","count":6,"id":33},{"name":"器件与工艺","count":6,"id":34},{"name":"国外技术之窗","count":6,"id":35},{"name":"EDA与设计方法学","count":5,"id":36},{"name":"业界专访","count":5,"id":37},{"name":"EDA与IP核","count":4,"id":38},{"name":"人才培养","count":4,"id":39},{"name":"创新之路","count":4,"id":40},{"name":"知识产权保护","count":4,"id":41},{"name":"系统开发","count":4,"id":42},{"name":"设备与材料","count":4,"id":43},{"name":"软件","count":4,"id":44},{"name":"EDA与设计方法","count":3,"id":45},{"name":"IC China专栏","count":3,"id":46},{"name":"专题报道","count":3,"id":47},{"name":"企业管理","count":3,"id":48},{"name":"制造工艺","count":3,"id":49},{"name":"发展趋势","count":3,"id":50},{"name":"可靠性","count":3,"id":51},{"name":"园区基地","count":3,"id":52},{"name":"工艺与器件","count":3,"id":53},{"name":"应用开发","count":3,"id":54},{"name":"专用材料与设备","count":2,"id":55},{"name":"产业发展专题","count":2,"id":56},{"name":"人才","count":2,"id":57},{"name":"园区与基地","count":2,"id":58},{"name":"工艺与制造","count":2,"id":59},{"name":"工艺制造","count":2,"id":60},{"name":"工艺设备","count":2,"id":61},{"name":"市场分析","count":2,"id":62},{"name":"应用与市场","count":2,"id":63},{"name":"新技术","count":2,"id":64},{"name":"特别报道","count":2,"id":65},{"name":"生产管理","count":2,"id":66},{"name":"表面分析","count":2,"id":67},{"name":"设计应用","count":2,"id":68},{"name":"SEMICON China 2017专栏","count":1,"id":69},{"name":"专用设备","count":1,"id":70},{"name":"专访","count":1,"id":71},{"name":"业界访谈","count":1,"id":72},{"name":"产业政策","count":1,"id":73},{"name":"代工服务","count":1,"id":74},{"name":"传感器","count":1,"id":75},{"name":"信息安全","count":1,"id":76},{"name":"光电器件","count":1,"id":77},{"name":"可靠性与安全技术","count":1,"id":78},{"name":"商端访谈","count":1,"id":79},{"name":"器件工艺","count":1,"id":80},{"name":"封装1","count":1,"id":81},{"name":"封装、装配与测试","count":1,"id":82},{"name":"封面报道","count":1,"id":83},{"name":"工艺器件","count":1,"id":84},{"name":"工艺技术","count":1,"id":85},{"name":"软件开发","count":1,"id":86},{"name":"通信会议报道","count":1,"id":87}]
