内容标题
×
内容
绑定机构
扫描成功
请在APP上操作
打开万方数据APP，点击右上角"扫一扫"，扫描二维码即可将您登录的个人账号与机构账号绑定，绑定后您可在APP上享有机构权限，如需更换机构账号，可到个人中心解绑。
登录机构账号
登录 / 注册
登录 / 注册
机构登录
学习中心
个人中心
社区
退出
简
繁
学习中心
应用
会员
这是测试提示消息
首页
>
期刊导航
>
世界电子元器件
世界电子元器件
Global Electronics China 세계전자원기건
主办单位：
中国电子信息产业发展研究院
主编：
胥京宇
出版周期：
月刊
语种：
中文
国际刊号：
1006-7604
国内刊号：
11-3540/TN
文献量：
5879
被引量：
6496
下载量：
88326
电话：
010-82888222
邮政编码：
100080
地址：
北京市北四环西路67号大地科技大厦1201-1218
文章浏览
特色栏目
统计分析
期刊简介
征稿启事
DOI服务
[{"name":"业界访谈","count":784,"id":1},{"name":"设计应用","count":497,"id":2},{"name":"全球IC新品指南","count":394,"id":3},{"name":"解决方案精选","count":332,"id":4},{"name":"Design & Applications","count":230,"id":5},{"name":"在线座谈精华","count":155,"id":6},{"name":"精英专访","count":147,"id":7},{"name":"月度明星产品","count":120,"id":8},{"name":"市场观象","count":114,"id":9},{"name":"模拟器件","count":109,"id":10},{"name":"Online Seminar Highlights","count":106,"id":11},{"name":"每月新品","count":90,"id":12},{"name":"全球IC新品指南月度新品总汇","count":82,"id":13},{"name":"通信元器件","count":74,"id":14},{"name":"通信及网络元器件","count":71,"id":15},{"name":"技术动态","count":58,"id":16},{"name":"市场分析与趋势","count":55,"id":17},{"name":"元器件装配","count":52,"id":18},{"name":"汽车电子","count":52,"id":19},{"name":"解决方案","count":49,"id":20},{"name":"可编程逻辑器件","count":46,"id":21},{"name":"通用元器件","count":46,"id":22},{"name":"专题报道","count":43,"id":23},{"name":"元器件价格走势","count":43,"id":24},{"name":"电源管理","count":43,"id":25},{"name":"数字家庭","count":42,"id":26},{"name":"手机元器件","count":41,"id":27},{"name":"全球Ic新品指南","count":40,"id":28},{"name":"半导体市场展望","count":40,"id":29},{"name":"IC技术讲座","count":36,"id":30},{"name":"微控制器/嵌入式系统","count":36,"id":31},{"name":"数字信号处理器","count":35,"id":32},{"name":"测试与测量","count":35,"id":33},{"name":"全球lC新品指南","count":32,"id":34},{"name":"月度推荐产品","count":32,"id":35},{"name":"Test & Measurement","count":31,"id":36},{"name":"电子百科","count":29,"id":37},{"name":"光电器件","count":28,"id":38},{"name":"Digital Home","count":26,"id":39},{"name":"测试测量","count":26,"id":40},{"name":"研讨会专题报道","count":26,"id":41},{"name":"国际手机元器件专刊","count":25,"id":42},{"name":"无源元件","count":25,"id":43},{"name":"Automobile Electronics","count":22,"id":44},{"name":"中电网在线座谈精华","count":22,"id":45},{"name":"传感器","count":22,"id":46},{"name":"Global IC Elites","count":21,"id":47},{"name":"微处理器/微控制器","count":21,"id":48},{"name":"月度新品总汇","count":21,"id":49},{"name":"Automotive Electronic","count":20,"id":50},{"name":"Embedded System","count":20,"id":51},{"name":"IC Technologies Forum","count":20,"id":52},{"name":"计算机元器件","count":20,"id":53},{"name":"频道述评","count":20,"id":54},{"name":"Component Price Tracker","count":18,"id":55},{"name":"嵌入式系统","count":17,"id":56},{"name":"Power Management Devices","count":16,"id":57},{"name":"2007国际嵌入式技术巡展专题报道","count":15,"id":58},{"name":"中国数字家电元器件技术研讨会精彩回顾","count":15,"id":59},{"name":"便携式产品设计","count":15,"id":60},{"name":"2006国际嵌入式技术巡展","count":14,"id":61},{"name":"Analog Devices","count":14,"id":62},{"name":"Devices for Mobile Phone","count":14,"id":63},{"name":"Semiconductor Market Outlook","count":14,"id":64},{"name":"医疗电子","count":14,"id":65},{"name":"技术市场展望","count":14,"id":66},{"name":"存储器","count":13,"id":67},{"name":"DSP,MCU,FPGA","count":12,"id":68},{"name":"微控制器","count":12,"id":69},{"name":"智能能源方案","count":12,"id":70},{"name":"消费类电子器件","count":12,"id":71},{"name":"DSP/MCU/FPGA","count":11,"id":72},{"name":"汽车电子元器件","count":11,"id":73},{"name":"飞思卡尔杯第六届设计应用大奖赛论文选编","count":11,"id":74},{"name":"制程与自动化设备","count":10,"id":75},{"name":"半导体制造","count":10,"id":76},{"name":"微处理器","count":10,"id":77},{"name":"智能工业与农业控制方案","count":10,"id":78},{"name":"热点技术","count":10,"id":79},{"name":"2004中国射频与宽带通信技术研讨会专题报道","count":9,"id":80},{"name":"2005中国手机元器件高峰会专题报道","count":9,"id":81},{"name":"2006中国电子元件领军厂商公开论坛","count":9,"id":82},{"name":"2009国际嵌入式技术巡展(RTECC)","count":9,"id":83},{"name":"Real-time and Embedded Computing Conference","count":9,"id":84},{"name":"Wireless Communication Technologies","count":9,"id":85},{"name":"仪器仪表","count":9,"id":86},{"name":"企业专栏","count":9,"id":87},{"name":"医疗、健康、安全","count":9,"id":88},{"name":"无线通信技术","count":9,"id":89},{"name":"消费电子","count":9,"id":90},{"name":"绿色能源与环保、节能技术","count":9,"id":91},{"name":"网络通信元器件","count":9,"id":92},{"name":"自主创造未来应用引领创新——2006年度\"中国芯\"技术与发展大会专题报道","count":9,"id":93},{"name":"2006 \"China Chip\" Technologies and Development Conference","count":8,"id":94},{"name":"Portable Devices Design","count":8,"id":95},{"name":"Wireless Communications","count":8,"id":96},{"name":"专题报道/电源","count":8,"id":97},{"name":"半导体设计","count":8,"id":98},{"name":"嵌入式系统技术","count":8,"id":99},{"name":"手机/无线通信元器件","count":8,"id":100},{"name":"2006全球IC市场分析与预测高峰论坛专题报道","count":7,"id":101},{"name":"Automotive Electronics Devices","count":7,"id":102},{"name":"Flat Panel & Optical Devices","count":7,"id":103},{"name":"Medical Electroincs","count":7,"id":104},{"name":"New Components of The Month","count":7,"id":105},{"name":"Passive Technologies","count":7,"id":106},{"name":"Real-Time & Embedded Computing Conference China 2006","count":7,"id":107},{"name":"全球IC市场分析与预测高峰论坛","count":7,"id":108},{"name":"分立器件","count":7,"id":109},{"name":"平板显示,光电器件","count":7,"id":110},{"name":"微控制器/处理器","count":7,"id":111},{"name":"摸拟器件","count":7,"id":112},{"name":"数字家电","count":7,"id":113},{"name":"智能城市及交通方案","count":7,"id":114},{"name":"智能终端与智能家居方案","count":7,"id":115},{"name":"车载网络及多媒体","count":7,"id":116},{"name":"3G & Mobile Video Receiving","count":6,"id":117},{"name":"3G技术,移动视频接收","count":6,"id":118},{"name":"Motorola DigitaIDNA视窗","count":6,"id":119},{"name":"Motorola DigitalDNA视窗","count":6,"id":120},{"name":"Passive Components","count":6,"id":121},{"name":"Portable Design","count":6,"id":122},{"name":"平板显示器件","count":6,"id":123},{"name":"应用于3G的模拟技术","count":6,"id":124},{"name":"技术前沿","count":6,"id":125},{"name":"新型无源元件","count":6,"id":126},{"name":"无线通信","count":6,"id":127},{"name":"电子元器件","count":6,"id":128},{"name":"IDH聚焦:基于MCU的热门解决方案系列","count":5,"id":129},{"name":"Industrial Control/Testing","count":5,"id":130},{"name":"专题报道/嵌入式系统","count":5,"id":131},{"name":"专题报道/工艺设备","count":5,"id":132},{"name":"专题报道/消费类电子","count":5,"id":133},{"name":"器件应用","count":5,"id":134},{"name":"工控/测试测量","count":5,"id":135},{"name":"市场前瞻","count":5,"id":136},{"name":"无源器件","count":5,"id":137},{"name":"模拟与电源管理器件","count":5,"id":138},{"name":"特色企业特色产品","count":5,"id":139},{"name":"电力电子器件","count":5,"id":140},{"name":"电子设计自动化","count":5,"id":141},{"name":"电源管理器件","count":5,"id":142},{"name":"美国国家半导体中国音频技术应用设计大赛专栏","count":5,"id":143},{"name":"\"国际嵌入式应用技术月\"专栏","count":4,"id":144},{"name":"MCU","count":4,"id":145},{"name":"Smart Industry","count":4,"id":146},{"name":"全球C新品指南月度新品总汇","count":4,"id":147},{"name":"半导体集成电路","count":4,"id":148},{"name":"数字家电元器件","count":4,"id":149},{"name":"新技术词典","count":4,"id":150},{"name":"无线通讯","count":4,"id":151},{"name":"智能工业","count":4,"id":152},{"name":"消费类电子","count":4,"id":153},{"name":"电路保护","count":4,"id":154},{"name":"车用控制器","count":4,"id":155},{"name":"集成电路","count":4,"id":156},{"name":"2006 China Component Leaders Open Forum","count":3,"id":157},{"name":"2007 Global IC Market Analysis & Forecast Summit","count":3,"id":158},{"name":"DSP、MCU、FPGA","count":3,"id":159},{"name":"Data Com & Network Components","count":3,"id":160},{"name":"Design & Ap plications","count":3,"id":161},{"name":"Design ＆ Applications","count":3,"id":162},{"name":"Design&Applications","count":3,"id":163},{"name":"Industrial control, sensor, testing","count":3,"id":164},{"name":"Online Seminar","count":3,"id":165},{"name":"Solutions","count":3,"id":166},{"name":"其他","count":3,"id":167},{"name":"工控、传感器、测试测量","count":3,"id":168},{"name":"工控自动化","count":3,"id":169},{"name":"智能医疗方案","count":3,"id":170},{"name":"通信网络技术","count":3,"id":171},{"name":"飞思卡尔FTF\"绿色\"设计应用大赛中国站获奖论文","count":3,"id":172},{"name":"Analog Technology","count":2,"id":173},{"name":"Design Applications","count":2,"id":174},{"name":"Green Technologies","count":2,"id":175},{"name":"IC精英专访","count":2,"id":176},{"name":"International Embedded Application Technology Month","count":2,"id":177},{"name":"Medical,Health,Safety","count":2,"id":178},{"name":"Smart Home","count":2,"id":179},{"name":"可编程逻辑","count":2,"id":180},{"name":"工业控制","count":2,"id":181},{"name":"工艺制造","count":2,"id":182},{"name":"市场现象","count":2,"id":183},{"name":"智能家居","count":2,"id":184},{"name":"消费类元器件","count":2,"id":185},{"name":"电源","count":2,"id":186},{"name":"电源技术","count":2,"id":187},{"name":"美国国家半导体中国音频技术应用设计大赛文章精选","count":2,"id":188},{"name":"表面安装技术","count":2,"id":189},{"name":"通信与计算机","count":2,"id":190},{"name":"音频技术","count":2,"id":191},{"name":"高新技术","count":2,"id":192},{"name":"2008国际嵌入式技术巡展(RTECC)","count":1,"id":193},{"name":"Component price Tracker","count":1,"id":194},{"name":"DSPMCU/FPGA","count":1,"id":195},{"name":"EE Wiki","count":1,"id":196},{"name":"Executives Interview","count":1,"id":197},{"name":"Foreland Vision","count":1,"id":198},{"name":"Green Energy Technologies","count":1,"id":199},{"name":"IC Technologies Forum-FPGA","count":1,"id":200}]
全部
近一年
近三年
近五年
查看更多栏目
<
1
/
1
>
排序：
年/期
被引
下载
批量选择
（已选择）
0
条
清除
导出
共有
0
篇文献
暂无数据
src='', frameborder='0',name='_blank', scrolling='no')
分享到微信朋友圈
打开微信，点击底部的“发现”，使用“扫一扫”即可将网页分享到我的朋友圈。
