内容标题
×
内容
绑定机构
扫描成功
请在APP上操作
打开万方数据APP，点击右上角"扫一扫"，扫描二维码即可将您登录的个人账号与机构账号绑定，绑定后您可在APP上享有机构权限，如需更换机构账号，可到个人中心解绑。
登录机构账号
登录 / 注册
登录 / 注册
机构登录
学习中心
个人中心
社区
退出
简
繁
学习中心
应用
会员
这是测试提示消息
首页
>
期刊导航
>
集成电路应用
集成电路应用
Applications of IC
主办单位：
上海贝岭股份有限公司
出版周期：
月刊
语种：
中文
国际刊号：
1674-2583
国内刊号：
31-1325/TN
影响因子：
0.50
文献量：
10519
被引量：
13273
下载量：
156938
基金论文量：
2214
电话：
021-24261143
邮政编码：
200233
地址：
上海宜山路810号
文章浏览
特色栏目
统计分析
期刊简介
征稿启事
DOI服务
[{"name":"创新应用","count":6280,"id":1},{"name":"Application","count":4322,"id":2},{"name":"Applications","count":2027,"id":3},{"name":"研究与设计","count":613,"id":4},{"name":"Research and Design","count":600,"id":5},{"name":"工艺与制造","count":486,"id":6},{"name":"Process and Fabrication","count":332,"id":7},{"name":"业界风云","count":238,"id":8},{"name":"市场分析","count":216,"id":9},{"name":"新技术聚焦","count":180,"id":10},{"name":"应用专题","count":159,"id":11},{"name":"行业分析","count":154,"id":12},{"name":"设计新技术","count":145,"id":13},{"name":"Processing & Manufacturing","count":122,"id":14},{"name":"市场综述","count":109,"id":15},{"name":"综合报道","count":96,"id":16},{"name":"Market Analysis","count":94,"id":17},{"name":"封装与测试","count":94,"id":18},{"name":"专题特写","count":91,"id":19},{"name":"电子中国","count":89,"id":20},{"name":"Departments","count":75,"id":21},{"name":"Packaging & Testing","count":68,"id":22},{"name":"器件与应用","count":52,"id":23},{"name":"新产品速递","count":52,"id":24},{"name":"区域动态","count":50,"id":25},{"name":"专题文章","count":48,"id":26},{"name":"产业新闻","count":44,"id":27},{"name":"产品与应用","count":44,"id":28},{"name":"中国报道","count":42,"id":29},{"name":"产业评论","count":37,"id":30},{"name":"设计诀窍","count":36,"id":31},{"name":"Electronics China","count":34,"id":32},{"name":"企业专访","count":33,"id":33},{"name":"话说芯片","count":33,"id":34},{"name":"Features","count":31,"id":35},{"name":"设计应用","count":31,"id":36},{"name":"封面故事","count":29,"id":37},{"name":"Cover Story","count":26,"id":38},{"name":"技术与应用","count":25,"id":39},{"name":"主编致辞","count":21,"id":40},{"name":"专题报道","count":20,"id":41},{"name":"SEMICON China特别报道","count":19,"id":42},{"name":"China Report","count":17,"id":43},{"name":"基础知识","count":17,"id":44},{"name":"封装技术","count":17,"id":45},{"name":"器件应用","count":16,"id":46},{"name":"分销与产业链","count":15,"id":47},{"name":"封装测试","count":15,"id":48},{"name":"Packaging and Testing","count":14,"id":49},{"name":"精英访谈","count":14,"id":50},{"name":"产业聚焦","count":13,"id":51},{"name":"企业与人才","count":13,"id":52},{"name":"供应商报道","count":13,"id":53},{"name":"读者信箱","count":13,"id":54},{"name":"预览","count":13,"id":55},{"name":"How to Make a Chip","count":12,"id":56},{"name":"arch and Design","count":11,"id":57},{"name":"编者话","count":11,"id":58},{"name":"专家观点","count":10,"id":59},{"name":"产品快讯","count":10,"id":60},{"name":"总编致辞","count":10,"id":61},{"name":"新闻与综述","count":10,"id":62},{"name":"原理与应用","count":9,"id":63},{"name":"设备与材料","count":9,"id":64},{"name":"会员之窗","count":8,"id":65},{"name":"制造技术","count":8,"id":66},{"name":"实用电路","count":8,"id":67},{"name":"市场纵横","count":8,"id":68},{"name":"应用解决方案","count":8,"id":69},{"name":"特别报道","count":8,"id":70},{"name":"生产工艺","count":8,"id":71},{"name":"Lithography","count":7,"id":72},{"name":"Special Report","count":7,"id":73},{"name":"Vendor Report","count":7,"id":74},{"name":"Yield Management","count":7,"id":75},{"name":"产业综述","count":7,"id":76},{"name":"封面特写","count":7,"id":77},{"name":"应用技术","count":7,"id":78},{"name":"新闻综述","count":7,"id":79},{"name":"设计决窍","count":7,"id":80},{"name":"PROCESSING & MANUFACTURING","count":6,"id":81},{"name":"企业访谈","count":6,"id":82},{"name":"光刻","count":6,"id":83},{"name":"参展企业精品展示","count":6,"id":84},{"name":"成品率管理","count":6,"id":85},{"name":"生产与测试","count":6,"id":86},{"name":"网络通讯·IC","count":6,"id":87},{"name":"设计苑地","count":6,"id":88},{"name":"Expert Perspectives","count":5,"id":89},{"name":"Feaatures","count":5,"id":90},{"name":"Wafer Processing","count":5,"id":91},{"name":"嵌入式MCU","count":5,"id":92},{"name":"嵌入式SOC","count":5,"id":93},{"name":"晶圆工艺","count":5,"id":94},{"name":"生产技术","count":5,"id":95},{"name":"行业协会","count":5,"id":96},{"name":"设计自动化","count":5,"id":97},{"name":"Electronics China·IC Design & Manufacturing","count":4,"id":98},{"name":"IC设计与制造","count":4,"id":99},{"name":"IC设计与应用","count":4,"id":100},{"name":"Industrial Focus","count":4,"id":101},{"name":"cover story","count":4,"id":102},{"name":"上海市集成电路行业协会成立大会","count":4,"id":103},{"name":"技术与工艺","count":4,"id":104},{"name":"电路集锦","count":4,"id":105},{"name":"芯片史话","count":4,"id":106},{"name":"设计","count":4,"id":107},{"name":"DSP","count":3,"id":108},{"name":"Editor's Note","count":3,"id":109},{"name":"Editor's Notes","count":3,"id":110},{"name":"Electronics China JC Design & Manufacturing","count":3,"id":111},{"name":"IC封装","count":3,"id":112},{"name":"Photovoltaics","count":3,"id":113},{"name":"SEMICON China 2008预览","count":3,"id":114},{"name":"Semiconductor Packaging","count":3,"id":115},{"name":"专题特定","count":3,"id":116},{"name":"主题特写","count":3,"id":117},{"name":"企业之星","count":3,"id":118},{"name":"企业纵览","count":3,"id":119},{"name":"光伏","count":3,"id":120},{"name":"全国集成电路行业工作会议","count":3,"id":121},{"name":"封装","count":3,"id":122},{"name":"工艺制造","count":3,"id":123},{"name":"技术诀窍","count":3,"id":124},{"name":"检测、测试和测量","count":3,"id":125},{"name":"汽车电子","count":3,"id":126},{"name":"测试技术","count":3,"id":127},{"name":"真空与技术","count":3,"id":128},{"name":"要闻","count":3,"id":129},{"name":"设备材料","count":3,"id":130},{"name":"评论","count":3,"id":131},{"name":"通信电路","count":3,"id":132},{"name":"Commentary","count":2,"id":133},{"name":"EDA专栏","count":2,"id":134},{"name":"Emerging Technology","count":2,"id":135},{"name":"Inspection,Measurement & Test","count":2,"id":136},{"name":"PACKAGING & TESTING","count":2,"id":137},{"name":"专题报告","count":2,"id":138},{"name":"他山之石","count":2,"id":139},{"name":"企业之窗","count":2,"id":140},{"name":"前沿技术","count":2,"id":141},{"name":"园区基地","count":2,"id":142},{"name":"封装工艺","count":2,"id":143},{"name":"封面文章","count":2,"id":144},{"name":"技术视点","count":2,"id":145},{"name":"视频电路","count":2,"id":146},{"name":"解决方案","count":2,"id":147},{"name":"设备·材料","count":2,"id":148},{"name":"音响·视频电路","count":2,"id":149},{"name":"COMMENTARY","count":1,"id":150},{"name":"COVER STORY","count":1,"id":151},{"name":"Departments Commentary","count":1,"id":152},{"name":"EDITOR'S NOTE","count":1,"id":153},{"name":"EXPERT PERSPECTIVE","count":1,"id":154},{"name":"Export Perspectives","count":1,"id":155},{"name":"FPD","count":1,"id":156},{"name":"HOW TO MAKE A CHIP","count":1,"id":157},{"name":"Industry Outlook","count":1,"id":158},{"name":"Inspection, Measurement & Test","count":1,"id":159},{"name":"Preview","count":1,"id":160},{"name":"SEMICON China 2008 Preview","count":1,"id":161},{"name":"VENDOR REPORT","count":1,"id":162},{"name":"Water Processing","count":1,"id":163},{"name":"主编寄词","count":1,"id":164},{"name":"主编致词","count":1,"id":165},{"name":"产业观察","count":1,"id":166},{"name":"会展报道","count":1,"id":167},{"name":"光刻工艺","count":1,"id":168},{"name":"创新发展","count":1,"id":169},{"name":"制造工艺","count":1,"id":170},{"name":"前沿研究","count":1,"id":171},{"name":"协会要闻","count":1,"id":172},{"name":"图表新闻","count":1,"id":173},{"name":"太阳能光伏","count":1,"id":174},{"name":"封面报道","count":1,"id":175},{"name":"新产品发布","count":1,"id":176},{"name":"材料应用","count":1,"id":177},{"name":"策探讨","count":1,"id":178},{"name":"经营管理","count":1,"id":179},{"name":"观点与思考","count":1,"id":180},{"name":"计算机电路","count":1,"id":181},{"name":"音响电路","count":1,"id":182}]
全部
近一年
近三年
近五年
查看更多栏目
<
1
/
1
>
排序：
年/期
被引
下载
批量选择
（已选择）
0
条
清除
导出
共有
6280
篇文献
题名
一种智能红外避障自动扫地机器人的设计
文摘阅读
260
下载
520
第三方链接
12
被引
9
作者: 汪光辉 朱晨昊 周正飞 万敏
年/期：2019/6
被引：9
下载：520
第三代半导体产业概况剖析
文摘阅读
638
下载
513
第三方链接
4
被引
68
作者: 李春 邓君楷
年/期：2017/2
被引：68
下载：513
第三代半导体带来的机遇与挑战
文摘阅读
341
下载
356
第三方链接
3
被引
39
作者: 林佳 黄浩生
年/期：2017/12
被引：39
下载：356
一种基于PLC的自动售货机系统的设计
文摘阅读
237
下载
311
第三方链接
4
被引
6
作者: 王晓丽
年/期：2019/2
被引：6
下载：311
探讨智能手环的几种设计方案
文摘阅读
261
下载
309
第三方链接
3
被引
1
作者: 陈君铭 叶政
年/期：2016/12
被引：1
下载：309
职业生涯规划的实践分析
文摘阅读
271
下载
298
第三方链接
19
被引
1
作者: 孔斐然
年/期：2021/6
被引：1
下载：298
基于STM32F103ZET6数字示波器设计
文摘阅读
845
下载
294
第三方链接
5
被引
13
作者: 姜瑞
年/期：2017/1
被引：13
下载：294
集成电路产业的发展状况与展望
文摘阅读
167
下载
288
第三方链接
0
被引
7
作者: 卢妃
年/期：2023/2
被引：7
下载：288
无人机的避障技术及其应用
文摘阅读
555
下载
241
第三方链接
1
被引
23
作者: 张西忱
年/期：2017/2
被引：23
下载：241
5G通信技术推动物联网产业链发展
文摘阅读
556
下载
233
第三方链接
0
被引
46
作者: 魏军
年/期：2017/1
被引：46
下载：233
1
2
3
4
5
6
7
下一页
src='', frameborder='0',name='_blank', scrolling='no')
分享到微信朋友圈
打开微信，点击底部的“发现”，使用“扫一扫”即可将网页分享到我的朋友圈。
