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电子产品世界
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Qutlook of Electronic Technology 전자품세계
CSTPCD(2015)
主办单位：
中国科学技术信息研究所（ISTIC)
主编：
丁坤善
出版周期：
月刊
语种：
中文
国际刊号：
1005-5517
国内刊号：
11-3374/TN
影响因子：
0.25
文献量：
12243
被引量：
23363
下载量：
274539
基金论文量：
634
电话：
010-58882090
邮政编码：
100038
地址：
北京市海淀区复兴路15号
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[{"name":"设计应用","count":997,"id":1},{"name":"业界风云","count":576,"id":2},{"name":"产业聚焦","count":430,"id":3},{"name":"Design Application","count":425,"id":4},{"name":"技术长廊","count":348,"id":5},{"name":"热门技术","count":307,"id":6},{"name":"Technology","count":302,"id":7},{"name":"设计天地","count":275,"id":8},{"name":"世界传真","count":267,"id":9},{"name":"市场","count":263,"id":10},{"name":"设计","count":258,"id":11},{"name":"Design","count":247,"id":12},{"name":"新产品之窗","count":236,"id":13},{"name":"市场纵横","count":231,"id":14},{"name":"市场观察","count":229,"id":15},{"name":"嵌入式系统","count":203,"id":16},{"name":"Special Report","count":196,"id":17},{"name":"要闻","count":188,"id":18},{"name":"IC与元器件","count":177,"id":19},{"name":"Focus Technology","count":155,"id":20},{"name":"Market Trends","count":151,"id":21},{"name":"应用长廊","count":144,"id":22},{"name":"技术专题","count":144,"id":23},{"name":"应用指南","count":140,"id":24},{"name":"通信与计算机","count":128,"id":25},{"name":"中国芯","count":125,"id":26},{"name":"关注焦点","count":110,"id":27},{"name":"设计思路","count":110,"id":28},{"name":"产业走势","count":107,"id":29},{"name":"新产品","count":101,"id":30},{"name":"商海观潮","count":100,"id":31},{"name":"测试测量","count":100,"id":32},{"name":"电源","count":100,"id":33},{"name":"高端访谈","count":96,"id":34},{"name":"设计新苑","count":95,"id":35},{"name":"元器件市场","count":94,"id":36},{"name":"半导体技术","count":88,"id":37},{"name":"专题 电子技术展望","count":77,"id":38},{"name":"Technology Corridor","count":73,"id":39},{"name":"技术与应用","count":72,"id":40},{"name":"技术分销","count":70,"id":41},{"name":"基金攻关项目展示","count":69,"id":42},{"name":"生产与测试","count":69,"id":43},{"name":"特别报道","count":66,"id":44},{"name":"元器件","count":61,"id":45},{"name":"工业控制","count":60,"id":46},{"name":"汽车电子","count":59,"id":47},{"name":"便携设计","count":57,"id":48},{"name":"特别采访","count":56,"id":49},{"name":"管理赏析","count":56,"id":50},{"name":"消费类电子","count":55,"id":51},{"name":"高校园地","count":55,"id":52},{"name":"自控与测量","count":52,"id":53},{"name":"产业趋势","count":51,"id":54},{"name":"产品推介","count":50,"id":55},{"name":"技术精粹","count":47,"id":56},{"name":"通信设计","count":46,"id":57},{"name":"产业热点","count":44,"id":58},{"name":"新品天地","count":44,"id":59},{"name":"Market Watch","count":43,"id":60},{"name":"中国专递","count":43,"id":61},{"name":"厂商特讯","count":43,"id":62},{"name":"设计应用(工业控制)","count":43,"id":63},{"name":"Spotlight","count":41,"id":64},{"name":"讲座","count":40,"id":65},{"name":"创新园地","count":39,"id":66},{"name":"光电器件","count":38,"id":67},{"name":"设计应用(消费类电子)","count":38,"id":68},{"name":"设计技术","count":38,"id":69},{"name":"平板显示器","count":36,"id":70},{"name":"军事电子","count":35,"id":71},{"name":"Industry Trends","count":34,"id":72},{"name":"AI讲座","count":33,"id":73},{"name":"飞思卡尔半导体技术园地","count":33,"id":74},{"name":"消费电子","count":32,"id":75},{"name":"通信与网络","count":32,"id":76},{"name":"Component Markets","count":31,"id":77},{"name":"Field Applications","count":31,"id":78},{"name":"林林总总","count":30,"id":79},{"name":"研究开发","count":30,"id":80},{"name":"专题","count":29,"id":81},{"name":"深度报道","count":29,"id":82},{"name":"Chinese Design","count":28,"id":83},{"name":"Industry Focus","count":28,"id":84},{"name":"公司专栏","count":28,"id":85},{"name":"分销渠道","count":28,"id":86},{"name":"可编程逻辑器件","count":28,"id":87},{"name":"IC市场","count":26,"id":88},{"name":"设计应用 -- 基金攻关项目展示","count":26,"id":89},{"name":"测试与测量","count":25,"id":90},{"name":"设计应用(元器件)","count":25,"id":91},{"name":"New Products Menu","count":24,"id":92},{"name":"周立功单片机专栏","count":24,"id":93},{"name":"模拟电路","count":24,"id":94},{"name":"访问手记","count":24,"id":95},{"name":"设计应用(汽车电子)","count":23,"id":96},{"name":"Design Field","count":22,"id":97},{"name":"Semiconductor Highlight","count":22,"id":98},{"name":"Supplement","count":22,"id":99},{"name":"夹岸来风","count":22,"id":100},{"name":"事业频道","count":21,"id":101},{"name":"技术专题(汽车电子)","count":21,"id":102},{"name":"数字信号处理器","count":21,"id":103},{"name":"数字消费类电子","count":21,"id":104},{"name":"无源与分立器件","count":21,"id":105},{"name":"设计应用(通信与网络)","count":21,"id":106},{"name":"Embedded Systems","count":20,"id":107},{"name":"Manufacturing & Test","count":20,"id":108},{"name":"学术论坛","count":20,"id":109},{"name":"测试测量与工业自动化","count":20,"id":110},{"name":"电源技术","count":20,"id":111},{"name":"电源管理","count":20,"id":112},{"name":"经营之道","count":20,"id":113},{"name":"观点","count":20,"id":114},{"name":"通信","count":20,"id":115},{"name":"飞思卡尔半导体","count":20,"id":116},{"name":"IC与应用","count":19,"id":117},{"name":"专题 测试测量","count":19,"id":118},{"name":"无线通信","count":18,"id":119},{"name":"专题 数字消费类电子","count":17,"id":120},{"name":"技术专题 (电子技术展望)","count":17,"id":121},{"name":"技术专题(可穿戴电子)","count":17,"id":122},{"name":"设计应用 -- 电源管理","count":17,"id":123},{"name":"采访报道","count":17,"id":124},{"name":"技术专题(新年技术展望)","count":16,"id":125},{"name":"测试测量与传感器","count":16,"id":126},{"name":"电子设计自动化","count":16,"id":127},{"name":"设计应用 -- 工业控制","count":16,"id":128},{"name":"MCU与边缘AI","count":15,"id":129},{"name":"专题 平板显示器","count":15,"id":130},{"name":"专题 电源","count":15,"id":131},{"name":"专题 通信元器件","count":15,"id":132},{"name":"设计者笔记","count":15,"id":133},{"name":"Consumer Electronics","count":14,"id":134},{"name":"信息家电","count":14,"id":135},{"name":"半导体与IC","count":14,"id":136},{"name":"嵌入式设计","count":14,"id":137},{"name":"技术专题 (电机控制)","count":14,"id":138},{"name":"本刊活动","count":14,"id":139},{"name":"设计应用 -- 汽车电子","count":14,"id":140},{"name":"设计应用(元件应用)","count":14,"id":141},{"name":"Business NEWS","count":13,"id":142},{"name":"半导体和IC","count":13,"id":143},{"name":"新品应用","count":13,"id":144},{"name":"模拟","count":13,"id":145},{"name":"模拟IC","count":13,"id":146},{"name":"汽车电动化","count":13,"id":147},{"name":"设计应用(学习论坛)","count":13,"id":148},{"name":"设计应用(智能应用)","count":13,"id":149},{"name":"Component Market","count":12,"id":150},{"name":"专题 嵌入式系统","count":12,"id":151},{"name":"专题 数字信号处理器","count":12,"id":152},{"name":"传感器","count":12,"id":153},{"name":"公司专栏 -- 飞思卡尔","count":12,"id":154},{"name":"展会追踪","count":12,"id":155},{"name":"技术专刊","count":12,"id":156},{"name":"技术专题(嵌入式系统)","count":12,"id":157},{"name":"设计应用 -- 嵌入式系统","count":12,"id":158},{"name":"设计应用(测试测量)","count":12,"id":159},{"name":"NEW PRODUCTS","count":11,"id":160},{"name":"信号调理","count":11,"id":161},{"name":"学习论坛","count":11,"id":162},{"name":"技术专题(测试测量)","count":11,"id":163},{"name":"技术专题(电子行业展望)","count":11,"id":164},{"name":"智能应用","count":11,"id":165},{"name":"设计应用 -- 测试测量","count":11,"id":166},{"name":"设计应用(嵌入式设计)","count":11,"id":167},{"name":"设计应用(模拟技术)","count":11,"id":168},{"name":"设计应用(物联网应用)","count":11,"id":169},{"name":"DSP","count":10,"id":170},{"name":"New Products","count":10,"id":171},{"name":"专题FPGA开发","count":10,"id":172},{"name":"产品推介.","count":10,"id":173},{"name":"企业大厦","count":10,"id":174},{"name":"工业无线","count":10,"id":175},{"name":"技术专题 (传感器技术)","count":10,"id":176},{"name":"技术透析","count":10,"id":177},{"name":"数字视听产品","count":10,"id":178},{"name":"显示技术","count":10,"id":179},{"name":"智能家居","count":10,"id":180},{"name":"飞思卡尔半导体园地","count":10,"id":181},{"name":"专家论坛","count":9,"id":182},{"name":"专题 便携式设计","count":9,"id":183},{"name":"专题 可编程逻辑器件","count":9,"id":184},{"name":"光电技术","count":9,"id":185},{"name":"医学电子","count":9,"id":186},{"name":"大奖赛","count":9,"id":187},{"name":"技术专题(工业物联网)","count":9,"id":188},{"name":"技术专题(电子技术展望)","count":9,"id":189},{"name":"技术专题(电机控制)","count":9,"id":190},{"name":"编辑视点","count":9,"id":191},{"name":"设计应用(嵌入式系统)","count":9,"id":192},{"name":"通信技术","count":9,"id":193},{"name":"高端观点","count":9,"id":194},{"name":"Focus Spotlight","count":8,"id":195},{"name":"IC应用","count":8,"id":196},{"name":"PLD","count":8,"id":197},{"name":"专题 无线通信与元器件","count":8,"id":198},{"name":"专题 音视频技术","count":8,"id":199},{"name":"便携式设备","count":8,"id":200}]
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